Inventor
HORVATH JOSEPH L
US8 patents
Patents
8 patentsUS5052481AOct 1, 1991
High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
IBM131 citations97
US4479140AOct 23, 1984
Thermal conduction element for conducting heat from semiconductor devices to a cold plate
IBM66 citations95
US4415025ANov 15, 1983
Thermal conduction element for semiconductor devices
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US5014117AMay 7, 1991
High conduction flexible fin cooling module
IBM46 citations92
US5159531AOct 27, 1992
Multiple radial finger contact cooling device
IBM43 citations91
US4620216AOct 28, 1986
Unitary slotted heat sink for semiconductor packages
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US4483389ANov 20, 1984
Telescoping thermal conduction element for semiconductor devices
IBM31 citations90
USD304715SNov 21, 1989
Heat sink or similar article
IBM7 citations72