Inventor

KIM DAE-WOO

KR71 patents

⚠️ This page may combine multiple inventors who share the name “KIM DAE-WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM DAE-WOO

INTEL CORP

Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages

Metal-free frame design for silicon bridges for semiconductor packages

Metal-free frame design for silicon bridges for semiconductor packages

Metal-free frame design for silicon bridges for semiconductor packages

Interconnect routing configurations and associated techniques

Guard ring design enabling in-line testing of silicon bridges for semiconductor packages

Rounded metal trace corner for stress reduction

Rounded metal trace corner for stress reduction

Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages

Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages

Interconnect routing configurations and associated techniques

Metal-free frame design for silicon bridges for semiconductor packages

Guard ring design enabling in-line testing of silicon bridges for semiconductor packages

Metal-free frame design for silicon bridges for semiconductor packages

Guard ring design enabling in-line testing of silicon bridges for semiconductor packages

EMIB copper layer for signal and power routing

Guard ring design enabling in-line testing of silicon bridges for semiconductor packages

Projecting contacts and method for making the same

Rounded metal trace corner for stress reduction

SAMSUNG ELECTRONICS CO LTD

Large diameter wafer conveying system and method thereof

Heat treatment equipment and method of driving the same

Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads

Semiconductor package

Leakage gas detector for semiconductor device and leakage gas detecting method using the same

Semiconductor package

Semiconductor package

Semiconductor package

Semiconductor package

POSCO

Steel material, for pressure vessel, showing excellent hydrogen-induced cracking resistance and method for preparing same

Steel plate for pressure vessel having excellent hydrogen induced cracking resistance and method of manufacturing same

Steel material showing excellent hydrogen-induced cracking resistance and method for preparing same

High-strength steel plate for pressure vessel having excellent toughness after post weld heat treatment and manufacturing method thereof

Steel for pressure vessel having excellent surface quality and impact toughness, and method for manufacturing same

KIM DAE-WOO

Organinc light emitting display device and method of manufacturing the same

Thin-film transistor array substrate, organic light-emitting display having the same, and method of manufacturing the organic light-emitting display

Thin film transistor array substrate, organic light emitting display device comprising the same, and method of manufacturing the thin film transistor array substrate

Organic light emitting display device and method for manufacturing the same

SAMSUNG DISPLAY CO LTD

Organic light emitting display device

Organic light-emitting display device and manufacturing method of the same

Organic light-emitting diode display having a repair line

Thin-film transistor array substrate, organic light-emitting display having the same, and method of manufacturing the organic light-emitting display

LG ELECTRONICS INC

Cooling apparatus and method for controlling the same

Cooling system of thin projector and method for controlling the same

Image pickup device, projector including the image pickup device, and image pickup method

LEE DAE-WOO

Organic light emitting diode display apparatus and method of manufacturing the same

SK HYNIX INC

Image sensor having outer and inner address markers

PARK JONG-HYUN

Organic light emitting diode display and manufacturing method thereof

HYNIX SEMICONDUCTOR INC

Method of forming fine patterns

POSCO CO LTD

Highly thick steel material having excellent low-temperature impact toughness and manufacturing method therefor

JUNG HEE TAE

Method for optical visualization of graphene domains