Inventor
FUERHAUPTER HARRY
US7 patents
⚠️ This page may combine multiple inventors who share the name “FUERHAUPTER HARRY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
6 patentsUS6093972AJul 25, 2000
Microelectronic package including a polymer encapsulated die
MOTOROLA INC125 citations96
US5895229AApr 20, 1999
Microelectronic package including a polymer encapsulated die, and method for forming same
MOTOROLA INC128 citations96
US5320272AJun 14, 1994
Tin-bismuth solder connection having improved high temperature properties, and process for forming same
MOTOROLA INC95 citations92
US5435838AJul 25, 1995
Immersion plating of tin-bismuth solder
MOTOROLA INC22 citations89
US5183692AFeb 2, 1993
Polyimide coating having electroless metal plate
MOTOROLA INC15 citations68
US5391402AFeb 21, 1995
Immersion plating of tin-bismuth solder
MOTOROLA INC1 citations48