Inventor
MISHINA HARUO
JP23 patents
⚠️ This page may combine multiple inventors who share the name “MISHINA HARUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI TECHNO ENG
19 patentsUS5932012AAug 3, 1999
Paste applicator having positioning means
HITACHI TECHNO ENG113 citations96
US5558015ASep 24, 1996
Hot press with pressure vessels to uniformly distribute pressure to the work piece
HITACHI TECHNO ENG76 citations95
US5716207AFeb 10, 1998
Heating furnace
HITACHI TECHNO ENG78 citations92
US5358166AOct 25, 1994
Reflow soldering apparatus
HITACHI TECHNO ENG25 citations92
US5437727AAug 1, 1995
Apparatus for drawing paste pattern on substrate
HITACHI TECHNO ENG43 citations91
US5415693AMay 16, 1995
Paste applicator
HITACHI TECHNO ENG46 citations91
US5333774AAug 2, 1994
Vapor reflow soldering apparatus
HITACHI TECHNO ENG28 citations91
US5197384AMar 30, 1993
Screen printer
HITACHI TECHNO ENG40 citations91
US5614024AMar 25, 1997
Apparatus for applying paste
HITACHI TECHNO ENG33 citations90
US5163599ANov 17, 1992
Reflow soldering apparatus
HITACHI TECHNO ENG30 citations90
US5038496AAug 13, 1991
Vapor reflow type soldering apparatus
HITACHI TECHNO ENG29 citations90
US5467912ANov 21, 1995
Reflow soldering apparatus for soldering electronic parts to circuit substrate
HITACHI TECHNO ENG33 citations89
US4996781AMar 5, 1991
Vapor reflow type soldering apparatus with an improved flux separating unit
HITACHI TECHNO ENG30 citations88
US4735001AApr 5, 1988
Vapor reflow type soldering apparatus
HITACHI TECHNO ENG23 citations76
US5156325AOct 20, 1992
Vapor reflow type soldering method and apparatus therefor
HITACHI TECHNO ENG19 citations72
US5146694ASep 15, 1992
Vapor reflow type soldering apparatus
HITACHI TECHNO ENG12 citations72
US4809443AMar 7, 1989
Apparatus for fixing electronic parts to printed circuit board
HITACHI TECHNO ENG10 citations72
US4776105AOct 11, 1988
Apparatus for fixing electronic parts to printed circuit board
HITACHI TECHNO ENG13 citations72
US5203487AApr 20, 1993
Reflow soldering method and system therefor
HITACHI TECHNO ENG17 citations71