P

Inventor

LEE SANGKYU

KR56 patents
⚠️ This page may combine multiple inventors who share the name “LEE SANGKYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

21 patents
US11935849B2Mar 19, 2024

Semiconductor package with an antenna substrate

SAMSUNG ELECTRONICS CO LTD2 citations72
US11735553B2Aug 22, 2023

Semiconductor package and method of manufacturing the semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations72
US11527495B2Dec 13, 2022

Semiconductor package with an antenna substrate

SAMSUNG ELECTRONICS CO LTD2 citations72
US11417613B2Aug 16, 2022

Semiconductor package

SAMSUNG ELECTRONICS CO LTD4 citations71
US11562939B2Jan 24, 2023

Semiconductor package including heat spreader layer

SAMSUNG ELECTRONICS CO LTD2 citations70
US9819381B2Nov 14, 2017

Electronic device including protective member

SAMSUNG ELECTRONICS CO LTD2 citations68
US12453107B2Oct 21, 2025

Semiconductor device and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US12040299B2Jul 16, 2024

Semiconductor package and method of manufacturing the semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61
US11973042B2Apr 30, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61
US11942434B2Mar 26, 2024

Method of manufacturing a semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61
US11569563B2Jan 31, 2023

Semiconductor packages and method of manufacturing semiconductor packages

SAMSUNG ELECTRONICS CO LTD1 citations61
US11342274B2May 24, 2022

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations61
US12183694B2Dec 31, 2024

Semiconductor package including antenna

SAMSUNG ELECTRONICS CO LTD0 citations60
US12040248B2Jul 16, 2024

Semiconductor package including heat spreader layer

SAMSUNG ELECTRONICS CO LTD0 citations60
US11637079B2Apr 25, 2023

Semiconductor package including antenna

SAMSUNG ELECTRONICS CO LTD0 citations60
US12463125B2Nov 4, 2025

Semiconductor package including post

SAMSUNG ELECTRONICS CO LTD0 citations59
US12500130B2Dec 16, 2025

Method of manufacture of fan-out type semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations56
US7935272B2May 3, 2011

Dispersant having multifunctional head and phosphor paste composition comprising the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US11094640B2Aug 17, 2021

Package module

SAMSUNG ELECTRONICS CO LTD0 citations50
US12575418B2Mar 10, 2026

Semiconductor packages having organic material layer between through-via structure and encapsulant that surrounds a portion of semiconductor chip

SAMSUNG ELECTRONICS CO LTD0 citations49
US12525526B2Jan 13, 2026

Semiconductor package and method of manufacturing the semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations49

LG ELECTRONICS INC

18 patents

HYUNDAI MOTOR CO LTD

4 patents

LG DISPLAY CO LTD

2 patents

YU MICHAEL

1 patent

SEOUL NAT UNIV R&DB FOUNDATION

1 patent

YOON SEON MI

1 patent

AGENCY DEFENSE DEV

1 patent

LEE SANGKYU

1 patent

Showing the top 50 of 56 patents by PatentIndex Score.