Inventor
TOKUNO KENICHI
JP10 patents
Patents
10 patentsUS6188127B1Feb 13, 2001
Semiconductor packing stack module and method of producing the same
NEC CORP226 citations97
US5869886AFeb 9, 1999
Flip chip semiconductor mounting structure with electrically conductive resin
NEC CORP111 citations97
US5892289AApr 6, 1999
Bare chip mounting structure and manufacturing method therefor
NEC CORP67 citations95
US5777847AJul 7, 1998
Multichip module having a cover wtih support pillar
NEC CORP81 citations95
US5883426AMar 16, 1999
Stack module
NEC CORP410 citations94
US5686763ANov 11, 1997
Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics
NEC CORP29 citations92
US5565704AOct 15, 1996
Memory card having two types of memory integrated circuits connected to two different shaped connectors
NEC CORP27 citations92
US6094354AJul 25, 2000
Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board
NEC CORP43 citations86
US5767689AJun 16, 1998
Bare chip test carrier with an improved holding structure for a semiconductor chip
NEC CORP19 citations83
US5763295AJun 9, 1998
Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics
NEC CORP11 citations73