Inventor
DOHYA AKIHIRO
JP11 patents
⚠️ This page may combine multiple inventors who share the name “DOHYA AKIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
8 patentsUS6188127B1Feb 13, 2001
Semiconductor packing stack module and method of producing the same
NEC CORP226 citations97
US5777847AJul 7, 1998
Multichip module having a cover wtih support pillar
NEC CORP81 citations95
US4736521AApr 12, 1988
Process for manufacturing a ceramic multi-layer substrate
NEC CORP80 citations95
US4665468AMay 12, 1987
Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
NEC CORP54 citations95
US5012047AApr 30, 1991
Multilayer wiring substrate
NEC CORP44 citations92
US5767689AJun 16, 1998
Bare chip test carrier with an improved holding structure for a semiconductor chip
NEC CORP19 citations83
US7297575B2Nov 20, 2007
System semiconductor device and method of manufacturing the same
NEC CORP3 citations62
US7098538B1Aug 29, 2006
System semiconductor device and method of manufacturing the same
NEC CORP4 citations62
NIPPON ELECTRIC CO
3 patentsUS4434544AMar 6, 1984
Multilayer circuit and process for manufacturing the same
NIPPON ELECTRIC CO27 citations90
US4786523ANov 22, 1988
Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
NIPPON ELECTRIC CO15 citations73
US4628149ADec 9, 1986
Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
NIPPON ELECTRIC CO11 citations73