P

Inventor

LEE JAE HEUNG

KR36 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE HEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

12 patents
US7979913B2Jul 12, 2011

Home network system and method therefor

SAMSUNG ELECTRONICS CO LTD11 citations83
US7788728B2Aug 31, 2010

Method and apparatus for limiting number of times contents can be accessed using hash chain

SAMSUNG ELECTRONICS CO LTD10 citations83
US7653713B2Jan 26, 2010

Method of measuring round trip time and proximity checking method using the same

SAMSUNG ELECTRONICS CO LTD9 citations83
US10147706B2Dec 4, 2018

Multi-chip package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations69
US7603722B2Oct 13, 2009

Scheduled-recording method that schedules recording of copy-protected content

SAMSUNG ELECTRONICS CO LTD3 citations63
US7436457B2Oct 14, 2008

Analog/digital signal processor and analog/digital signal processing method

SAMSUNG ELECTRONICS CO LTD4 citations62
US8005758B2Aug 23, 2011

Encryption/decryption method and apparatus for controlling content use based on license information

SAMSUNG ELECTRONICS CO LTD2 citations61
US7848526B2Dec 7, 2010

Method of receiving session key in home network and method of reproducing content using the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US8347076B2Jan 1, 2013

System and method for building home domain using smart card which contains information of home network member device

SAMSUNG ELECTRONICS CO LTD1 citations51
US7826615B2Nov 2, 2010

Scrambling apparatus and method using conversion of motion vector information of video data

SAMSUNG ELECTRONICS CO LTD0 citations51
US10679972B2Jun 9, 2020

Method of manufacturing multi-chip package

SAMSUNG ELECTRONICS CO LTD0 citations48
US10658326B2May 19, 2020

Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire

SAMSUNG ELECTRONICS CO LTD0 citations45

KOREA RES INST CHEM TECH

7 patents

(unassigned)

2 patents

HAN SUNG-HYU

2 patents

CHEIL JEDANG CORP

2 patents

KIM BONG-SEON

2 patents

KIM MYUNG-SUN

2 patents

HONG YOUNG-TAIK

1 patent

KIM YONG SEOK

1 patent

KOREA RES INST CHEMICAL TECH

1 patent

LEE SUN-NAM

1 patent

LEE JAE-HEUNG

1 patent

WEON JONG IL

1 patent

JUNG HYUN MIN

1 patent