Inventor
LEE JAE HEUNG
KR36 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE HEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS7979913B2Jul 12, 2011
Home network system and method therefor
SAMSUNG ELECTRONICS CO LTD11 citations83
US7788728B2Aug 31, 2010
Method and apparatus for limiting number of times contents can be accessed using hash chain
SAMSUNG ELECTRONICS CO LTD10 citations83
US7653713B2Jan 26, 2010
Method of measuring round trip time and proximity checking method using the same
SAMSUNG ELECTRONICS CO LTD9 citations83
US10147706B2Dec 4, 2018
Multi-chip package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations69
US7603722B2Oct 13, 2009
Scheduled-recording method that schedules recording of copy-protected content
SAMSUNG ELECTRONICS CO LTD3 citations63
US7436457B2Oct 14, 2008
Analog/digital signal processor and analog/digital signal processing method
SAMSUNG ELECTRONICS CO LTD4 citations62
US8005758B2Aug 23, 2011
Encryption/decryption method and apparatus for controlling content use based on license information
SAMSUNG ELECTRONICS CO LTD2 citations61
US7848526B2Dec 7, 2010
Method of receiving session key in home network and method of reproducing content using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US8347076B2Jan 1, 2013
System and method for building home domain using smart card which contains information of home network member device
SAMSUNG ELECTRONICS CO LTD1 citations51
US7826615B2Nov 2, 2010
Scrambling apparatus and method using conversion of motion vector information of video data
SAMSUNG ELECTRONICS CO LTD0 citations51
US10679972B2Jun 9, 2020
Method of manufacturing multi-chip package
SAMSUNG ELECTRONICS CO LTD0 citations48
US10658326B2May 19, 2020
Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire
SAMSUNG ELECTRONICS CO LTD0 citations45
KOREA RES INST CHEM TECH
7 patentsUS6172127B1Jan 9, 2001
Preparation of polyimide foam
KOREA RES INST CHEM TECH25 citations91
US5521276AMay 28, 1996
Polyamideimide resins containing isophorone diamine structures
KOREA RES INST CHEM TECH18 citations81
US6433184B1Aug 13, 2002
Polyamide-imide having head-to-tail backbone
KOREA RES INST CHEM TECH5 citations60
US6232432B1May 15, 2001
Process for the preparation of polycarbonates
KOREA RES INST CHEM TECH3 citations60
US7662904B2Feb 16, 2010
Aromatic polyether resins crosslinked by amic acid or imide side chain
KOREA RES INST CHEM TECH0 citations51
US6423812B1Jul 23, 2002
Process of preparing polycarbonates
KOREA RES INST CHEM TECH0 citations48
US6525109B2Feb 25, 2003
Process of preparing polycarbonates using microwave
KOREA RES INST CHEM TECH1 citations47
(unassigned)
2 patentsHAN SUNG-HYU
2 patentsUS8983071B2Mar 17, 2015
Key management method using hierarchical node topology, and method of registering and deregistering user using the same
HAN SUNG-HYU12 citations81
US8341402B2Dec 25, 2012
Method of controlling content access and method of obtaining content key using the same
HAN SUNG-HYU4 citations60