Inventor
IWASAKI TOSHIHIRO
JP24 patents
⚠️ This page may combine multiple inventors who share the name “IWASAKI TOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
8 patentsUS7951699B2May 31, 2011
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP16 citations82
US9818679B2Nov 14, 2017
Semiconductor device
RENESAS ELECTRONICS CORP1 citations63
US9171791B2Oct 27, 2015
Semiconductor device
RENESAS ELECTRONICS CORP3 citations63
US10134663B2Nov 20, 2018
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US9171814B2Oct 27, 2015
Method of manufacturing semiconductor device and semiconductor device
RENESAS ELECTRONICS CORP1 citations52
US8994175B2Mar 31, 2015
Method of manufacturing semiconductor device and semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US10037966B2Jul 31, 2018
Semiconductor device and manufacturing method therefor
RENESAS ELECTRONICS CORP0 citations37
US9837369B2Dec 5, 2017
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP0 citations37
MITSUBISHI ELECTRIC CORP
4 patentsUS6677677B2Jan 13, 2004
Semiconductor device
MITSUBISHI ELECTRIC CORP59 citations95
US6462425B1Oct 8, 2002
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP36 citations92
US6404059B1Jun 11, 2002
Semiconductor device having a mounting structure and fabrication method thereof
MITSUBISHI ELECTRIC CORP7 citations72
US6509206B2Jan 21, 2003
Method and apparatus for manufacturing semiconductor device, and semiconductor device manufactured by the method
MITSUBISHI ELECTRIC CORP5 citations63
RENESAS TECH CORP
4 patentsUS6777814B2Aug 17, 2004
Semiconductor device
RENESAS TECH CORP28 citations91
US7443036B2Oct 28, 2008
Manufacturing method of semiconductor device
RENESAS TECH CORP11 citations84
US6756686B2Jun 29, 2004
Semiconductor device
RENESAS TECH CORP8 citations72
US7745258B2Jun 29, 2010
Manufacturing method of semiconductor device
RENESAS TECH CORP2 citations62
J DEVICES CORP
4 patentsUS9368474B2Jun 14, 2016
Manufacturing method for semiconductor device
J DEVICES CORP8 citations82
US10256196B2Apr 9, 2019
Semiconductor device and method for manufacturing same
J DEVICES CORP3 citations71
US9922931B2Mar 20, 2018
Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structure
J DEVICES CORP0 citations51
US9362200B2Jun 7, 2016
Heat sink in the aperture of substrate
J DEVICES CORP1 citations50