Inventor
ADVINCULA ABELARDO JR HADAP
SG10 patents
⚠️ This page may combine multiple inventors who share the name “ADVINCULA ABELARDO JR HADAP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CAMACHO ZIGMUND RAMIREZ
5 patentsUS8258614B2Sep 4, 2012
Integrated circuit package system with package integration
CAMACHO ZIGMUND RAMIREZ3 citations62
US8115287B2Feb 14, 2012
Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ5 citations59
US9059074B2Jun 16, 2015
Integrated circuit package system with planar interconnect
CAMACHO ZIGMUND RAMIREZ1 citations52
US8957515B2Feb 17, 2015
Integrated circuit package system with array of external interconnects
CAMACHO ZIGMUND RAMIREZ0 citations52
US8129827B2Mar 6, 2012
Integrated circuit package system with package encapsulation having recess
CAMACHO ZIGMUND RAMIREZ1 citations51
STATS CHIPPAC LTD
4 patentsUS7919850B2Apr 5, 2011
Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof
STATS CHIPPAC LTD12 citations84
US7855444B2Dec 21, 2010
Mountable integrated circuit package system with substrate
STATS CHIPPAC LTD6 citations73
US7785929B2Aug 31, 2010
Mountable integrated circuit package system with exposed external interconnects
STATS CHIPPAC LTD5 citations62
US7919848B2Apr 5, 2011
Integrated circuit package system with multiple devices
STATS CHIPPAC LTD0 citations52