Inventor
PISIGAN JAIRUS LEGASPI
SG31 patents
⚠️ This page may combine multiple inventors who share the name “PISIGAN JAIRUS LEGASPI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CAMACHO ZIGMUND RAMIREZ
13 patentsUS8106499B2Jan 31, 2012
Integrated circuit packaging system with a dual substrate package and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ15 citations84
US8080867B2Dec 20, 2011
Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ5 citations74
US8304869B2Nov 6, 2012
Fan-in interposer on lead frame for an integrated circuit package on package system
CAMACHO ZIGMUND RAMIREZ6 citations73
US8941219B2Jan 27, 2015
Etched recess package on package system
CAMACHO ZIGMUND RAMIREZ3 citations63
US8766428B2Jul 1, 2014
Integrated circuit packaging system with flip chip and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ3 citations63
US8502371B2Aug 6, 2013
Integrated circuit package system with extended corner leads
CAMACHO ZIGMUND RAMIREZ2 citations63
US8338233B2Dec 25, 2012
Method of manufacture of integrated circuit packaging system with stacked integrated circuit
CAMACHO ZIGMUND RAMIREZ3 citations63
US8258614B2Sep 4, 2012
Integrated circuit package system with package integration
CAMACHO ZIGMUND RAMIREZ3 citations62
US8652881B2Feb 18, 2014
Integrated circuit package system with anti-peel contact pads
CAMACHO ZIGMUND RAMIREZ0 citations52
US8148825B2Apr 3, 2012
Integrated circuit package system with leadfinger
CAMACHO ZIGMUND RAMIREZ0 citations52
US8148208B2Apr 3, 2012
Integrated circuit package system with leaded package and method for manufacturing thereof
CAMACHO ZIGMUND RAMIREZ0 citations52
US8129827B2Mar 6, 2012
Integrated circuit package system with package encapsulation having recess
CAMACHO ZIGMUND RAMIREZ1 citations51
US8558369B2Oct 15, 2013
Integrated circuit packaging system with interconnects and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ1 citations47
STATS CHIPPAC LTD
8 patentsUS7915716B2Mar 29, 2011
Integrated circuit package system with leadframe array
STATS CHIPPAC LTD62 citations98
US7691674B1Apr 6, 2010
Integrated circuit packaging system with stacked device and method of manufacturing thereof
STATS CHIPPAC LTD19 citations92
US8354742B2Jan 15, 2013
Method and apparatus for a package having multiple stacked die
STATS CHIPPAC LTD11 citations84
US7977780B2Jul 12, 2011
Multi-layer package-on-package system
STATS CHIPPAC LTD16 citations84
US7977782B2Jul 12, 2011
Integrated circuit package system with dual connectivity
STATS CHIPPAC LTD7 citations84
US7915724B2Mar 29, 2011
Integrated circuit packaging system with base structure device
STATS CHIPPAC LTD6 citations62
US7932130B2Apr 26, 2011
Method for forming an etched recess package on package system
STATS CHIPPAC LTD1 citations52
US7777354B2Aug 17, 2010
Integrated circuit package system with leaded package
STATS CHIPPAC LTD0 citations52
BATHAN HENRY DESCALZO
5 patentsUS8304337B2Nov 6, 2012
Integrated circuit packaging system with bond wire pads and method of manufacture thereof
BATHAN HENRY DESCALZO3 citations63
US8236607B2Aug 7, 2012
Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
BATHAN HENRY DESCALZO3 citations63
US9034692B2May 19, 2015
Integrated circuit packaging system with a flip chip and method of manufacture thereof
BATHAN HENRY DESCALZO0 citations52
US8106502B2Jan 31, 2012
Integrated circuit packaging system with plated pad and method of manufacture thereof
BATHAN HENRY DESCALZO0 citations52
US8802555B2Aug 12, 2014
Integrated circuit packaging system with interconnects and method of manufacture thereof
BATHAN HENRY DESCALZO1 citations51