Inventor

TSUI ANTHONY C

US9 patents

⚠️ This page may combine multiple inventors who share the name “TSUI ANTHONY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GEM SERVICES INC

3 patents

US8358017B2Jan 22, 2013

Semiconductor package featuring flip-chip die sandwiched between metal layers

GEM SERVICES INC29 citations91

US7838339B2Nov 23, 2010

Semiconductor device package having features formed by stamping

GEM SERVICES INC14 citations84

US7691670B2Apr 6, 2010

Interconnection of lead frame to die utilizing flip chip process

GEM SERVICES INC5 citations72

SILICONIX INC

2 patents

US6249041B1Jun 19, 2001

IC chip package with directly connected leads

SILICONIX INC196 citations97

US6066890AMay 23, 2000

Separate circuit devices in an intra-package configuration and assembly techniques

SILICONIX INC53 citations92

TSUI ANTHONY C

1 patent

US8106493B2Jan 31, 2012

Semiconductor device package having features formed by stamping

TSUI ANTHONY C3 citations57

HARNDEN JAMES

1 patent

US8097945B2Jan 17, 2012

Bi-directional, reverse blocking battery switch

HARNDEN JAMES2 citations53

ESLAMY MOHAMMAD

1 patent

US8120154B2Feb 21, 2012

Interconnection of lead frame to die utilizing flip chip process

ESLAMY MOHAMMAD0 citations44

CHIA ANTHONY

1 patent

US8558368B2Oct 15, 2013

Bi-directional, reverse blocking battery switch

CHIA ANTHONY0 citations43