Inventor
JACOBS TOBIAS
DE18 patents
⚠️ This page may combine multiple inventors who share the name “JACOBS TOBIAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC EUROPE LTD
6 patentsUS9907087B2Feb 27, 2018
Method for providing M2M data
NEC EUROPE LTD2 citations72
US9210542B2Dec 8, 2015
Method and computer system for detecting crowds in a location tracking system
NEC EUROPE LTD4 citations72
US10394862B2Aug 27, 2019
Method and system for semantically querying a database by a machine-to-machine application
NEC EUROPE LTD5 citations69
US9794743B2Oct 17, 2017
Method for performing distributed geographic event processing and geographic event processing system
NEC EUROPE LTD0 citations51
US10433104B2Oct 1, 2019
Method and system for realizing a geofence scenario with an NGSI-system
NEC EUROPE LTD0 citations41
US10320642B2Jun 11, 2019
Dynamic TCP proxy selection for acceleration of short network flows
NEC EUROPE LTD0 citations40
NEC Laboratories Europe GmbH
6 patentsUS11288567B2Mar 29, 2022
Method for training deep neural network (DNN) using auxiliary regression targets
NEC Laboratories Europe GmbH2 citations71
US11303124B2Apr 12, 2022
Method and system for demand-response signal assignment in power distribution systems
NEC Laboratories Europe GmbH0 citations61
US9998865B2Jun 12, 2018
Method for performing distributed geographic event processing and geographic event processing system
NEC Laboratories Europe GmbH0 citations51
US12417439B2Sep 16, 2025
Offline machine learning for automatic action determination or decision making support
NEC Laboratories Europe GmbH0 citations50
US12530478B2Jan 20, 2026
Automated data sharing and analytics using a privacy-preserving data space platform
NEC Laboratories Europe GmbH0 citations46
US12164484B2Dec 10, 2024
Data schema matching to optimize the quality of applications
NEC Laboratories Europe GmbH0 citations41
INFINEON TECHNOLOGIES AG
4 patentsUS8994148B2Mar 31, 2015
Device bond pads over process control monitor structures in a semiconductor die
INFINEON TECHNOLOGIES AG3 citations58
US9871017B2Jan 16, 2018
Multi-level chip interconnect
INFINEON TECHNOLOGIES AG0 citations51
US9219031B2Dec 22, 2015
Chip arrangement, and method for forming a chip arrangement
INFINEON TECHNOLOGIES AG0 citations51
US9401343B2Jul 26, 2016
Method of processing a semiconductor wafer
INFINEON TECHNOLOGIES AG0 citations47