Inventor
ZUNIGA-ORTIZ EDGAR R
US6 patents
Patents
6 patentsUS7268415B2Sep 11, 2007
Semiconductor device having post-mold nickel/palladium/gold plated leads
TEXAS INSTRUMENTS INC27 citations91
US6768210B2Jul 27, 2004
Bumpless wafer scale device and board assembly
TEXAS INSTRUMENTS INC51 citations91
US6914332B2Jul 5, 2005
Flip-chip without bumps and polymer for board assembly
TEXAS INSTRUMENTS INC16 citations83
US7368328B2May 6, 2008
Semiconductor device having post-mold nickel/palladium/gold plated leads
TEXAS INSTRUMENTS INC8 citations72
US8648430B2Feb 11, 2014
Microelectromechanical system having movable element integrated into substrate-based package
TEXAS INSTRUMENTS INC3 citations61
US7910471B2Mar 22, 2011
Bumpless wafer scale device and board assembly
TEXAS INSTRUMENTS INC1 citations51