Inventor

LIN YI-JOU

TW37 patents

⚠️ This page may combine multiple inventors who share the name “LIN YI-JOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN YI-JOU

MEDIATEK INC

Semiconductor package with dummy MIM capacitor die

Semiconductor chip package and fabrication method thereof

Semiconductor package structure having an annular frame with truncated corners

Semiconductor package with dummy MIM capacitor die

Semiconductor chip package and fabrication method thereof

Semiconductor package structure

Semiconductor package structure having an annular frame with truncated corners

Electronic package with rotated semiconductor die

Semiconductor package having a stiffener ring

Electronic package with rotated semiconductor die

Semiconductor package structure having an annular frame with truncated corners

Semiconductor package structure

Semiconductor package structure

Electronic package with rotated semiconductor die

Semiconductor package structure and method for forming the same

Semiconductor package structure and method for forming the same

Semiconductor package structure

Semiconductor package structure

Semiconductor package structure

TAIWAN SEMICONDUCTOR MFG CO LTD

Interconnect structure for package-on-package devices and a method of fabricating

Interconnect structure for package-on-package devices and a method of fabricating

Interconnect structure for package-on-package devices

Interconnect structure for package-on-package devices

Using metal-containing layer to reduce carrier shock in package formation

Interconnect structure for package-on-package devices

Using metal-containing layer to reduce carrier shock in package formation

Integrated fan-out package, package-on-package structure, and manufacturing method thereof

Integrated fan-out package, package-on-package structure, and manufacturing method thereof

Fan-out package structure and method for forming the same

Stacked semiconductor device and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG

Method of fabricating interconnect structure for package-on-package devices

Packages with passive devices and methods of forming the same

LIN YI-JOU

Projector and projecting lens of the projector

Projector, projecting lens of the projector and method of projecting images

YU CHEN-HUA

Packages with passive devices and methods of forming the same

JAU LAANG IND CO LTD

Projector and projecting lens thereof

MEDIA TEK INC

Semiconductor package having a stiffener ring