P

Inventor

NOMURA YOSHIHIRO

JP51 patents
⚠️ This page may combine multiple inventors who share the name “NOMURA YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

15 patents
US6265782B1Jul 24, 2001

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

HITACHI CHEMICAL CO LTD99 citations97
US7061081B2Jun 13, 2006

Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof

HITACHI CHEMICAL CO LTD24 citations92
US6621170B2Sep 16, 2003

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

HITACHI CHEMICAL CO LTD29 citations92
US6462148B1Oct 8, 2002

Adhesive film of quinoline polymer and bismaleimide

HITACHI CHEMICAL CO LTD23 citations92
US5212279AMay 18, 1993

Hot-melt adhesive and its use in polyimide film and printed circuit board

HITACHI CHEMICAL CO LTD31 citations90
US6523446B1Feb 25, 2003

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

HITACHI CHEMICAL CO LTD13 citations81
US6558500B2May 6, 2003

Method of producing a lead frame with composite film attached, and use of the lead frame

HITACHI CHEMICAL CO LTD9 citations74
US5998020ADec 7, 1999

Composite film and lead frame with composite film attached

HITACHI CHEMICAL CO LTD5 citations74
US5180786AJan 19, 1993

Impact modifier, thermoplastic resin composition using the same and molded article obtained therefrom

HITACHI CHEMICAL CO LTD14 citations72
US6445076B1Sep 3, 2002

Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same

HITACHI CHEMICAL CO LTD10 citations71
US4954612ASep 4, 1990

Solvent-soluble polyimide and production thereof

HITACHI CHEMICAL CO LTD13 citations70
US6302991B1Oct 16, 2001

Method of producing a lead frame with composite film attached, and use of the lead frame

HITACHI CHEMICAL CO LTD1 citations63
US7560307B2Jul 14, 2009

Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same

HITACHI CHEMICAL CO LTD1 citations52
US7449076B2Nov 11, 2008

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

HITACHI CHEMICAL CO LTD0 citations49
US7273654B2Sep 25, 2007

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

HITACHI CHEMICAL CO LTD0 citations49

TOYOTA MOTOR CO LTD

8 patents

HONDA MOTOR CO LTD

7 patents

TOSHIBA KK

4 patents

RICOH KK

3 patents

NOMURA YOSHIHIRO

3 patents

TOYOTA CHUO KENKYUSHO KK

2 patents

TAMAKI KENJI

2 patents

RENESAS ELECTRONICS CORP

2 patents

TOYODA CHUO KENKYUSHO KK

1 patent

AJINOMOTO KK

1 patent

DAINIPPON PRINTING CO LTD

1 patent

TANAKA TOSHIYA

1 patent

Showing the top 50 of 51 patents by PatentIndex Score.