Inventor
PONNUSWAMY THOMAS A
US25 patents
⚠️ This page may combine multiple inventors who share the name “PONNUSWAMY THOMAS A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
14 patentsUS6755954B2Jun 29, 2004
Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements
NOVELLUS SYSTEMS INC140 citations97
US9449808B2Sep 20, 2016
Apparatus for advanced packaging applications
NOVELLUS SYSTEMS INC21 citations92
US9899230B2Feb 20, 2018
Apparatus for advanced packaging applications
NOVELLUS SYSTEMS INC10 citations84
US9534308B2Jan 3, 2017
Protecting anodes from passivation in alloy plating systems
NOVELLUS SYSTEMS INC5 citations84
US9476139B2Oct 25, 2016
Cleaning electroplating substrate holders using reverse current deplating
NOVELLUS SYSTEMS INC10 citations84
US9455139B2Sep 27, 2016
Methods and apparatus for wetting pretreatment for through resist metal plating
NOVELLUS SYSTEMS INC11 citations82
US10954605B2Mar 23, 2021
Protecting anodes from passivation in alloy plating systems
NOVELLUS SYSTEMS INC1 citations73
US10106907B2Oct 23, 2018
Protecting anodes from passivation in alloy plating systems
NOVELLUS SYSTEMS INC2 citations73
US10087545B2Oct 2, 2018
Automated cleaning of wafer plating assembly
NOVELLUS SYSTEMS INC3 citations73
US10301738B2May 28, 2019
Methods and apparatus for wetting pretreatment for through resist metal plating
NOVELLUS SYSTEMS INC1 citations71
US9828688B2Nov 28, 2017
Methods and apparatus for wetting pretreatment for through resist metal plating
NOVELLUS SYSTEMS INC3 citations71
US9359688B1Jun 7, 2016
Apparatuses and methods for controlling PH in electroplating baths
NOVELLUS SYSTEMS INC5 citations71
US11542630B2Jan 3, 2023
Cleaning electroplating substrate holders using reverse current deplating
NOVELLUS SYSTEMS INC0 citations62
US10538855B2Jan 21, 2020
Cleaning electroplating substrate holders using reverse current deplating
NOVELLUS SYSTEMS INC1 citations62
LAM RES CORP
7 patentsUS10648097B2May 12, 2020
Copper electrodeposition on cobalt lined features
LAM RES CORP2 citations71
US10211052B1Feb 19, 2019
Systems and methods for fabrication of a redistribution layer to avoid etching of the layer
LAM RES CORP5 citations71
US10190232B2Jan 29, 2019
Apparatuses and methods for maintaining pH in nickel electroplating baths
LAM RES CORP2 citations68
US11699590B2Jul 11, 2023
Copper electrodeposition sequence for the filling of cobalt lined features
LAM RES CORP0 citations61
US11168407B2Nov 9, 2021
Copper electrodeposition on cobalt lined features
LAM RES CORP0 citations61
US12293943B2May 6, 2025
Gold through silicon mask plating
LAM RES CORP0 citations47
US10714436B2Jul 14, 2020
Systems and methods for achieving uniformity across a redistribution layer
LAM RES CORP0 citations40
PONNUSWAMY THOMAS A
3 patentsUS8513124B1Aug 20, 2013
Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
PONNUSWAMY THOMAS A30 citations91
US8703615B1Apr 22, 2014
Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
PONNUSWAMY THOMAS A21 citations89
US8500983B2Aug 6, 2013
Pulse sequence for plating on thin seed layers
PONNUSWAMY THOMAS A20 citations88