Inventor · disambiguated record
Cheng-Liang Cho
Also filed as: CHO CHENG-LIANG
2 granted patents·4 citations·filing 2015–2017
46Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0176US10170429B2Method for forming package structure including intermetallic compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·3 cites·20 claims
- 0253US10213986B2Electric connection and method of manufacturing the sameUNIV NAT CHENG KUNG·Filed 2015·Granted Feb 26, 2019·1 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →