Inventor
CHU ISABEL CRISTINA
US6 patents
⚠️ This page may combine multiple inventors who share the name “CHU ISABEL CRISTINA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS10957850B2Mar 23, 2021
Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication
IBM6 citations72
US10692925B2Jun 23, 2020
Dielectric fill for memory pillar elements
IBM3 citations72
US10832945B2Nov 10, 2020
Techniques to improve critical dimension width and depth uniformity between features with different layout densities
IBM0 citations51
US10622250B2Apr 14, 2020
Dielectric gap fill evaluation for integrated circuits
IBM0 citations50
US10312140B1Jun 4, 2019
Dielectric gap fill evaluation for integrated circuits
IBM0 citations50