Inventor
LEE SANG GYUN
KR2 patents
Patents
2 patentsUS10529676B2Jan 7, 2020
Semiconductor assembly with package on package structure and electronic device including the same
SAMSUNG ELECTRONICS CO LTD2 citations70
US11037890B2Jun 15, 2021
Semiconductor assembly with package on package structure and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations57