Inventor
LIU JUNJUN
US36 patents
⚠️ This page may combine multiple inventors who share the name “LIU JUNJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
11 patentsUS9443725B2Sep 13, 2016
Multi-step system and method for curing a dielectric film
TOKYO ELECTRON LTD465 citations98
US9184047B2Nov 10, 2015
Multi-step system and method for curing a dielectric film
TOKYO ELECTRON LTD465 citations98
US7977256B2Jul 12, 2011
Method for removing a pore-generating material from an uncured low-k dielectric film
TOKYO ELECTRON LTD504 citations98
US7858533B2Dec 28, 2010
Method for curing a porous low dielectric constant dielectric film
TOKYO ELECTRON LTD522 citations98
US7622378B2Nov 24, 2009
Multi-step system and method for curing a dielectric film
TOKYO ELECTRON LTD487 citations98
US7666754B2Feb 23, 2010
Method and system for forming an air gap structure
TOKYO ELECTRON LTD21 citations92
US7855123B2Dec 21, 2010
Method of integrating an air gap structure with a substrate
TOKYO ELECTRON LTD13 citations84
US10147640B2Dec 4, 2018
Method for removing back-filled pore-filling agent from a cured porous dielectric
TOKYO ELECTRON LTD2 citations73
US10068765B2Sep 4, 2018
Multi-step system and method for curing a dielectric film
TOKYO ELECTRON LTD2 citations73
US7829268B2Nov 9, 2010
Method for air gap formation using UV-decomposable materials
TOKYO ELECTRON LTD2 citations62
US10347503B2Jul 9, 2019
Method and hardware for enhanced removal of post etch polymer and hardmask removal
TOKYO ELECTRON LTD0 citations52
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD
6 patentsUS10615151B2Apr 7, 2020
Integrated circuit multichip stacked packaging structure and method
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD4 citations69
US10847496B2Nov 24, 2020
Chip wiring method and structure
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD1 citations62
US11335664B2May 17, 2022
Integrated circuit packaging method and integrated packaging circuit
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD0 citations48
US11183458B2Nov 23, 2021
Integrated circuit packaging structure and method
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD0 citations48
US10930634B2Feb 23, 2021
Integrated circuit system and packaging method therefor
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD0 citations48
US10867959B2Dec 15, 2020
Integrated circuit packaging method and integrated packaged circuit
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD0 citations48
LIU JUNJUN
4 patentsUS9017933B2Apr 28, 2015
Method for integrating low-k dielectrics
LIU JUNJUN463 citations98
US8642488B2Feb 4, 2014
Multi-step system and method for curing a dielectric film
LIU JUNJUN468 citations97
US8895942B2Nov 25, 2014
Dielectric treatment module using scanning IR radiation source
LIU JUNJUN44 citations93
USD1059946SFeb 4, 2025
Lid with straw
LIU JUNJUN6 citations85