Inventor
JEZEWSKI CHRISTOPHER
US25 patents
Patents
25 patentsUS11444024B2Sep 13, 2022
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP10 citations84
US9253884B2Feb 2, 2016
Electronic fabric with incorporated chip and interconnect
INTEL CORP6 citations84
US9165824B2Oct 20, 2015
Interconnects with fully clad lines
INTEL CORP11 citations83
US12107085B2Oct 1, 2024
Interconnect techniques for electrically connecting source/drain regions of stacked transistors
INTEL CORP2 citations73
US11742346B2Aug 29, 2023
Interconnect techniques for electrically connecting source/drain regions of stacked transistors
INTEL CORP3 citations73
US9736936B2Aug 15, 2017
Electronic fabric with incorporated chip and interconnect
INTEL CORP3 citations73
US11830788B2Nov 28, 2023
Integrated circuits and methods for forming integrated circuits
INTEL CORP2 citations72
US11171239B2Nov 9, 2021
Transistor channel passivation with 2D crystalline material
INTEL CORP2 citations72
US12027458B2Jul 2, 2024
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP2 citations71
US12211794B2Jan 28, 2025
Integrated circuits and methods for forming thin film crystal layers
INTEL CORP0 citations62
US12165917B2Dec 10, 2024
Integrated circuit interconnect structures with ultra-thin metal chalcogenide barrier materials
INTEL CORP0 citations62
US12107170B2Oct 1, 2024
Transistor channel passivation with 2D crystalline material
INTEL CORP0 citations62
US11888034B2Jan 30, 2024
Transistors with metal chalcogenide channel materials
INTEL CORP1 citations62
US11637185B2Apr 25, 2023
Contact stacks to reduce hydrogen in semiconductor devices
INTEL CORP0 citations62
US11482622B2Oct 25, 2022
Adhesion structure for thin film transistor
INTEL CORP0 citations62
US11276644B2Mar 15, 2022
Integrated circuits and methods for forming thin film crystal layers
INTEL CORP1 citations62
US11164809B2Nov 2, 2021
Integrated circuits and methods for forming integrated circuits
INTEL CORP0 citations62
US12482744B2Nov 25, 2025
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP0 citations61
US11664305B2May 30, 2023
Staggered lines for interconnect performance improvement and processes for forming such
INTEL CORP0 citations61
US12525488B2Jan 13, 2026
Interconnect line structures with metal chalcogenide cap materials
INTEL CORP0 citations60
US12394716B2Aug 19, 2025
Integrated circuit interconnect structures with graphene cap
INTEL CORP1 citations59
US11670588B2Jun 6, 2023
Selectable vias for back end of line interconnects
INTEL CORP0 citations52
US10201081B2Feb 5, 2019
Electronic fabric with incorporated chip and interconnect
INTEL CORP0 citations52
US12598977B2Apr 7, 2026
Fill of vias in single and dual damascene structures using self-assembled monolayer
INTEL CORP0 citations49
US11749560B2Sep 5, 2023
Cladded metal interconnects
INTEL CORP0 citations46