P

Inventor

HAN SUNG

KR29 patents
⚠️ This page may combine multiple inventors who share the name “HAN SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

17 patents
US10720900B2Jul 21, 2020

Acoustic resonator and method

SAMSUNG ELECTRO MECH2 citations73
US10009007B2Jun 26, 2018

Bulk acoustic wave resonator with a molybdenum tantalum alloy electrode and filter including the same

SAMSUNG ELECTRO MECH4 citations73
US10541668B2Jan 21, 2020

Acoustic resonator and method of manufacturing the same

SAMSUNG ELECTRO MECH2 citations72
US11909380B2Feb 20, 2024

Acoustic resonator and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations62
US11558034B2Jan 17, 2023

Acoustic resonator filter

SAMSUNG ELECTRO MECH0 citations62
US10756700B2Aug 25, 2020

Bulk acoustic wave resonator device

SAMSUNG ELECTRO MECH1 citations62
US9173291B2Oct 27, 2015

Circuit board and method for manufacturing the same

SAMSUNG ELECTRO MECH3 citations62
US10637436B2Apr 28, 2020

Bulk acoustic wave resonator and filter including the same

SAMSUNG ELECTRO MECH0 citations52
US10396755B2Aug 27, 2019

Resonator having frame and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations52
US10855249B2Dec 1, 2020

Bulk acoustic wave resonator and filter including the same

SAMSUNG ELECTRO MECH0 citations51
US10630258B2Apr 21, 2020

Acoustic wave resonator and filter including the same

SAMSUNG ELECTRO MECH0 citations51
US10439589B2Oct 8, 2019

Bulk acoustic wave resonator and filter including the same

SAMSUNG ELECTRO MECH0 citations51
US9386706B2Jul 5, 2016

Line width protector printed circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations51
US12556158B2Feb 17, 2026

Acoustic resonator package

SAMSUNG ELECTRO MECH0 citations50
US12526919B2Jan 13, 2026

Printed circuit board

SAMSUNG ELECTRO MECH0 citations50
US12482606B2Nov 25, 2025

Multilayered ceramic capacitor

SAMSUNG ELECTRO MECH0 citations47
US8957319B2Feb 17, 2015

Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same

SAMSUNG ELECTRO MECH1 citations45

SAMSUNG ELECTRONICS CO LTD

10 patents

SANDIA CORP

1 patent

ENTEGRIS INC

1 patent