Inventor
KIM JIN GU
KR36 patents
⚠️ This page may combine multiple inventors who share the name “KIM JIN GU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
10 patentsUS10043772B2Aug 7, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH7 citations84
US9264010B2Feb 16, 2016
Via structure having open stub and printed circuit board having the same
SAMSUNG ELECTRO MECH9 citations83
US10312195B2Jun 4, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH3 citations73
US8026590B2Sep 27, 2011
Die package and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations63
US9173291B2Oct 27, 2015
Circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH3 citations62
US7947530B2May 24, 2011
Method of manufacturing wafer level package including coating and removing resin over the dicing lines
SAMSUNG ELECTRO MECH5 citations62
US9629260B2Apr 18, 2017
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations52
US9035196B2May 19, 2015
Circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US8373537B2Feb 12, 2013
Resistor having parallel structure and method of fabricating the same
SAMSUNG ELECTRO MECH1 citations52
US9253873B2Feb 2, 2016
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
SAMSUNG ELECTRONICS CO LTD
6 patentsUS5949496ASep 7, 1999
Color correction device for correcting color distortion and gamma characteristic
SAMSUNG ELECTRONICS CO LTD124 citations98
US10748856B2Aug 18, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD8 citations83
US6016168AJan 18, 2000
Color correction device
SAMSUNG ELECTRONICS CO LTD10 citations74
US7617540B2Nov 10, 2009
Method for managing download of duplicate contents
SAMSUNG ELECTRONICS CO LTD7 citations73
US11670623B2Jun 6, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11515265B2Nov 29, 2022
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
KIM JIN GU
4 patentsUS8830689B2Sep 9, 2014
Interposer-embedded printed circuit board
KIM JIN GU19 citations82
US8502295B2Aug 6, 2013
Nonvolatile memory device
KIM JIN GU5 citations72
US9093736B2Jul 28, 2015
Common mode filter and method for manufacturing the same
KIM JIN GU1 citations51
US8685852B2Apr 1, 2014
Method of forming metal line of semiconductor device
KIM JIN GU0 citations51
HYUNDAI ELECTRONICS IND
3 patentsUS6363004B1Mar 26, 2002
Nonvolatile ferroelectric memory having shunt lines
HYUNDAI ELECTRONICS IND25 citations92
US6482658B2Nov 19, 2002
Nonvolatile ferroelectric memory having shunt lines
HYUNDAI ELECTRONICS IND14 citations84
US6320783B1Nov 20, 2001
Nonvolatile ferroelectric memory device and circuit for driving the same
HYUNDAI ELECTRONICS IND10 citations74
PARK SEUNG WOOK
3 patentsUS8143099B2Mar 27, 2012
Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer
PARK SEUNG WOOK8 citations83
US8704350B2Apr 22, 2014
Stacked wafer level package and method of manufacturing the same
PARK SEUNG WOOK11 citations82
US8658467B2Feb 25, 2014
Method of manufacturing stacked wafer level package
PARK SEUNG WOOK7 citations81