Inventor
JEON HYUNG JIN
KR27 patents
⚠️ This page may combine multiple inventors who share the name “JEON HYUNG JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
12 patentsUS7663250B2Feb 16, 2010
Wafer level package and manufacturing method thereof
SAMSUNG ELECTRO MECH26 citations92
US7632709B2Dec 15, 2009
Method of manufacturing wafer level package
SAMSUNG ELECTRO MECH7 citations73
US9966179B2May 8, 2018
Common mode filter for improving magnetic permeability and high frequency characteristics
SAMSUNG ELECTRO MECH2 citations71
US11342110B2May 24, 2022
Inductor
SAMSUNG ELECTRO MECH2 citations70
US9928953B2Mar 27, 2018
Coil component and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations69
US11538620B2Dec 27, 2022
Coil electronic component
SAMSUNG ELECTRO MECH0 citations62
US9173291B2Oct 27, 2015
Circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH3 citations62
US7947530B2May 24, 2011
Method of manufacturing wafer level package including coating and removing resin over the dicing lines
SAMSUNG ELECTRO MECH5 citations62
US9196506B2Nov 24, 2015
Method for manufacturing interposer
SAMSUNG ELECTRO MECH2 citations61
US11935682B2Mar 19, 2024
Coil component and manufacturing method for the same
SAMSUNG ELECTRO MECH0 citations59
US11763970B2Sep 19, 2023
Coil electronic component
SAMSUNG ELECTRO MECH0 citations59
US9609183B2Mar 28, 2017
Camera module and electronic device including the same
SAMSUNG ELECTRO MECH0 citations51
LG ELECTRONICS INC
5 patentsUS6314066B1Nov 6, 2001
Method for controlling track jump in optical recording medium
LG ELECTRONICS INC31 citations92
US6747932B1Jun 8, 2004
Apparatus and method for detecting non-recording regions of an optical recording medium
LG ELECTRONICS INC12 citations73
US7012861B1Mar 14, 2006
Track jump method for a recording medium
LG ELECTRONICS INC6 citations62
US5845014ADec 1, 1998
Circuit for deciding DCT block classes
LG ELECTRONICS INC4 citations62
US7315492B2Jan 1, 2008
Header mask signal generating track jump method for a recording medium
LG ELECTRONICS INC0 citations52
PARK SEUNG WOOK
3 patentsUS8143099B2Mar 27, 2012
Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer
PARK SEUNG WOOK8 citations83
US8704350B2Apr 22, 2014
Stacked wafer level package and method of manufacturing the same
PARK SEUNG WOOK11 citations82
US8658467B2Feb 25, 2014
Method of manufacturing stacked wafer level package
PARK SEUNG WOOK7 citations81