Inventor
AMOS DAVID
GB19 patents
⚠️ This page may combine multiple inventors who share the name “AMOS DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ICEOTOPE GROUP LTD
16 patentsUS11096313B2Aug 17, 2021
Heat sink, heat sink arrangement and module for liquid immersion cooling
ICEOTOPE GROUP LTD33 citations97
US11490546B2Nov 1, 2022
Cooling system for electronic modules
ICEOTOPE GROUP LTD18 citations93
US11470739B2Oct 11, 2022
Heat sink, heat sink arrangement and module for liquid immersion cooling
ICEOTOPE GROUP LTD12 citations93
US11968802B2Apr 23, 2024
Heat sink, heat sink arrangement and module for liquid immersion cooling
ICEOTOPE GROUP LTD4 citations85
US11778790B2Oct 3, 2023
Fluid cooling system
ICEOTOPE GROUP LTD8 citations85
US11737247B2Aug 22, 2023
Fluid cooling system
ICEOTOPE GROUP LTD9 citations85
US11653472B2May 16, 2023
Heat sink, heat sink arrangement and module for liquid immersion cooling
ICEOTOPE GROUP LTD9 citations85
US11596082B2Feb 28, 2023
Heat sink, heat sink arrangement and module for liquid immersion cooling
ICEOTOPE GROUP LTD6 citations85
US11369040B2Jun 21, 2022
Heat sink, heat sink arrangement and module for liquid immersion cooling
ICEOTOPE GROUP LTD8 citations85
US11963338B2Apr 16, 2024
Cooling system for electronic modules
ICEOTOPE GROUP LTD10 citations84
US11917796B2Feb 27, 2024
Heat sink for liquid cooling
ICEOTOPE GROUP LTD4 citations73
US12096595B2Sep 17, 2024
Cold plate and system for cooling electronic devices
ICEOTOPE GROUP LTD3 citations71
US12575058B2Mar 10, 2026
Dielectric coolant distribution manifold
ICEOTOPE GROUP LTD0 citations62
US12538451B2Jan 27, 2026
Heat sink, heat sink arrangement and module for liquid immersion cooling
ICEOTOPE GROUP LTD0 citations62
US12446186B2Oct 14, 2025
Nozzle arrangement and cooling module
ICEOTOPE GROUP LTD0 citations50
US12538452B2Jan 27, 2026
System for cooling electronic devices in an electronic module
ICEOTOPE GROUP LTD0 citations49