Inventor
MCCORMICK JOHN P
12 patents
⚠️ This page may combine multiple inventors who share the name “MCCORMICK JOHN P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
11 patentsUS6369448B1Apr 9, 2002
Vertically integrated flip chip semiconductor package
LSI LOGIC CORP189 citations98
US6558978B1May 6, 2003
Chip-over-chip integrated circuit package
LSI LOGIC CORP91 citations97
US6166434ADec 26, 2000
Die clip assembly for semiconductor package
LSI LOGIC CORP128 citations97
US5909057AJun 1, 1999
Integrated heat spreader/stiffener with apertures for semiconductor package
LSI LOGIC CORP142 citations97
US6294840B1Sep 25, 2001
Dual-thickness solder mask in integrated circuit package
LSI LOGIC CORP70 citations95
US6706622B1Mar 16, 2004
Bonding pad interface
LSI LOGIC CORP26 citations92
US6002171ADec 14, 1999
Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
LSI LOGIC CORP38 citations92
US7041516B2May 9, 2006
Multi chip module assembly
LSI LOGIC CORP7 citations73
US5780924AJul 14, 1998
Integrated circuit underfill reservoir
LSI LOGIC CORP9 citations73
US6943446B2Sep 13, 2005
Via construction for structural support
LSI LOGIC CORP4 citations62
US6777314B2Aug 17, 2004
Method of forming electrolytic contact pads including layers of copper, nickel, and gold
LSI LOGIC CORP1 citations52