Inventor

HUNG CHIA-MING

TW38 patents

⚠️ This page may combine multiple inventors who share the name “HUNG CHIA-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUNG CHIA-MING

TAIWAN SEMICONDUCTOR MFG CO LTD

Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device

Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity

Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications

Microelectromechanical systems (MEMS) devices at different pressures

Semiconductor arrangement and formation thereof

MEMS device with enhanced sensing structure and manufacturing method thereof

Monolithic MEMS platform for integrated pressure, temperature, and gas sensor

Semiconductor arrangement and formation thereof

Semiconductor device and method of manufacturing

High speed optical receiver system

Conductive bond structure to increase membrane sensitivity in MEMS device

Conductive bond structure to increase membrane sensitivity in MEMS device

Semiconductor arrangement and formation thereof

Bond wave optimization method and device

Bond wave optimization method and device

Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformity

Microelectromechanical systems (MEMS) devices at different pressures

Thin film structure for hermetic sealing

Dielectric protection layer configured to increase performance of mems device

Energy-harvesting device

Semiconductor device and method of manufacture

Semiconductor device comprising different types of microelectromechanical systems devices

Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformity

Semiconductor device comprising different types of microelectromechanical systems devices

Semiconductor device and manufacturing method

TAIWAN SEMICONDUCTOR MFG

Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)

Micro-electro mechanical system (MEMS) structures and methods of forming the same

Sensor with energy-harvesting device

Energy-harvesting device and method of forming the same

Method of manufacturing a MEMS device

SHU CHIA-PAO

Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same

Structure and method for motion sensor

Hybrid MEMS bump design to prevent in-process and in-use stiction

CHUNG TIEN-KAN

Sensor with energy-harvesting device

MEMS kinetic energy conversion

LITE ON TECHNOLOGY CORP

Environment detection device and environment detection method suitable for street lamp

HUNG CHIA-MING

Electrical bypass structure for MEMS device

CHU CHIA-HUA

Package systems having a conductive element through a substrate thereof and manufacturing methods of the same