Inventor

BANDO AKIO

JP4 patents

Patents

4 patents

US5953624ASep 14, 1999

Bump forming method

SHINKAWA KK116 citations93

US5205460AApr 27, 1993

Bonding apparatus

SHINKAWA KK26 citations91

US5156318AOct 20, 1992

Ultrasonic bonding apparatus for bonding a semiconductor device to a tab tape

SHINKAWA KK35 citations91

US4887758ADec 19, 1989

Apparatus for connecting external leads

SHINKAWA KK25 citations91