Inventor
HOMMA TETSUYA
JP20 patents
⚠️ This page may combine multiple inventors who share the name “HOMMA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
18 patentsUS5399529AMar 21, 1995
Process for producing semiconductor devices
NEC CORP269 citations99
US5334552AAug 2, 1994
Method for fabricating a semiconductor device having a multi-layered interconnection structure
NEC CORP302 citations99
US5215787AJun 1, 1993
Method of forming silicon oxide film containing fluorine
NEC CORP288 citations99
US5420075AMay 30, 1995
Forming multi-layered interconnections with fluorine compound treatment permitting selective deposition of insulator
NEC CORP293 citations98
US5506177AApr 9, 1996
Fabrication process for multilevel interconnections in a semiconductor device
NEC CORP93 citations96
US5840631ANov 24, 1998
Method of manufacturing semiconductor device
NEC CORP48 citations92
US5607880AMar 4, 1997
Method of fabricating multilevel interconnections in a semiconductor integrated circuit
NEC CORP40 citations92
US5521424AMay 28, 1996
Semiconductor device having a silicon oxide film containing fluorine atoms
NEC CORP29 citations92
US5491108AFeb 13, 1996
Method of producing semiconductor integrated circuit device having interplayer insulating film covering substrate
NEC CORP20 citations92
US5468682ANov 21, 1995
Method of manufacturing semiconductor device using the abrasive
NEC CORP39 citations92
US5444023AAug 22, 1995
Method of fabricating a semiconductor device having a multilayer wiring structure and using a fluorine compound-containing gas
NEC CORP33 citations92
US5407529AApr 18, 1995
Method for manufacturing semiconductor device
NEC CORP24 citations92
US5405805AApr 11, 1995
Method for forming interconnect structure, insulating films and surface protective films of semiconductor device
NEC CORP43 citations92
US5776829AJul 7, 1998
Method for forming multilevel interconnections in a semiconductor device
NEC CORP20 citations84
US5744378AApr 28, 1998
Method for fabricating a semiconductor device having multilevel interconnections
NEC CORP19 citations84
US5939771AAug 17, 1999
Semiconductor device having an organic resin layer and silicon oxide layer containing fluorine for preventing crosstalk between metal lines and a method of manufacturing the same
NEC CORP16 citations74
US6054383AApr 25, 2000
Fabrication method of semiconductor device
NEC CORP11 citations73
US5891234AApr 6, 1999
Spin on glass material and method for forming a semiconductor device by using improved spin on glass material
NEC CORP6 citations73