P

Inventor

HOMMA TETSUYA

JP20 patents
⚠️ This page may combine multiple inventors who share the name “HOMMA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

18 patents
US5399529AMar 21, 1995

Process for producing semiconductor devices

NEC CORP269 citations99
US5334552AAug 2, 1994

Method for fabricating a semiconductor device having a multi-layered interconnection structure

NEC CORP302 citations99
US5215787AJun 1, 1993

Method of forming silicon oxide film containing fluorine

NEC CORP288 citations99
US5420075AMay 30, 1995

Forming multi-layered interconnections with fluorine compound treatment permitting selective deposition of insulator

NEC CORP293 citations98
US5506177AApr 9, 1996

Fabrication process for multilevel interconnections in a semiconductor device

NEC CORP93 citations96
US5840631ANov 24, 1998

Method of manufacturing semiconductor device

NEC CORP48 citations92
US5607880AMar 4, 1997

Method of fabricating multilevel interconnections in a semiconductor integrated circuit

NEC CORP40 citations92
US5521424AMay 28, 1996

Semiconductor device having a silicon oxide film containing fluorine atoms

NEC CORP29 citations92
US5491108AFeb 13, 1996

Method of producing semiconductor integrated circuit device having interplayer insulating film covering substrate

NEC CORP20 citations92
US5468682ANov 21, 1995

Method of manufacturing semiconductor device using the abrasive

NEC CORP39 citations92
US5444023AAug 22, 1995

Method of fabricating a semiconductor device having a multilayer wiring structure and using a fluorine compound-containing gas

NEC CORP33 citations92
US5407529AApr 18, 1995

Method for manufacturing semiconductor device

NEC CORP24 citations92
US5405805AApr 11, 1995

Method for forming interconnect structure, insulating films and surface protective films of semiconductor device

NEC CORP43 citations92
US5776829AJul 7, 1998

Method for forming multilevel interconnections in a semiconductor device

NEC CORP20 citations84
US5744378AApr 28, 1998

Method for fabricating a semiconductor device having multilevel interconnections

NEC CORP19 citations84
US5939771AAug 17, 1999

Semiconductor device having an organic resin layer and silicon oxide layer containing fluorine for preventing crosstalk between metal lines and a method of manufacturing the same

NEC CORP16 citations74
US6054383AApr 25, 2000

Fabrication method of semiconductor device

NEC CORP11 citations73
US5891234AApr 6, 1999

Spin on glass material and method for forming a semiconductor device by using improved spin on glass material

NEC CORP6 citations73

NEC CORPROATION

1 patent

HOMMA TETSUYA

1 patent