Inventor

MICHEL BRUNO

CH100 patents

⚠️ This page may combine multiple inventors who share the name “MICHEL BRUNO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICHEL BRUNO

IBM

Integrated circuit stack

Semiconductor device with a high thermal dissipation efficiency

Variable flow computer cooling system for a data center and method of operation

Lithographic surface or thin layer modification

Stamp for a lithographic process

Semiconductor device with a high thermal dissipation efficiency

Cantilever deflection sensor and use thereof

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Variable flow computer cooling system for a data center and method of operation

Variable performance server system and method of operation

Patterned structure for a thermal interface

Method and device for flowing a liquid on a surface

Printing in a medium

High performance integrated MLC cooling device for high power density ICS and method for manufacturing

Liquid crystal display

Optical lithography beyond conventional resolution limits

Method for printing a catalyst on substrates for electroless deposition

Method of oriented depositing chemically defined bodies

Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies

Desalination system and method for desalination

Silicone elastomer stamp with hydrophilic surfaces and method of making same

Patterning method

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Semiconductor device with a high thermal dissipation efficiency

Semiconductor chip assembly with flexible metal cantilevers

Selective etching of substrates with control of the etch profile

Desalination system and method for desalination

Photovoltaic thermal hybrid systems and method of operation thereof

Thermal interface with a patterned structure

Fabrication method

Method and device for identification of a substance

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Method and device for flowing a liquid on a surface

Method for forming patterns for semiconductor devices

BRUNSCHWILER THOMAS J

Variable flow computer cooling system for a data center and method of operation

Cooling device

Integrated circuit stack

BERNSTEIN KERRY

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly

BAROWSKI HARRY

Integrated circuit package connected to a data transmission medium

Thermal power plane for integrated circuits

Optimized semiconductor packaging in a three-dimensional stack

HITACHI GLOBAL STORAGE TECH

System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning

System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding

ITT MFG ENTERPRISES INC

Multiple electrical switch arrangement

GLOBALFOUNDRIES INC

Method and device for cooling a heat generating component