P

Inventor

OGURE NAOAKI

JP34 patents
⚠️ This page may combine multiple inventors who share the name “OGURE NAOAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EBARA CORP

31 patents
US6294059B1Sep 25, 2001

Substrate plating apparatus

EBARA CORP83 citations98
US6387182B1May 14, 2002

Apparatus and method for processing substrate

EBARA CORP113 citations97
US6921722B2Jul 26, 2005

Coating, modification and etching of substrate surface with particle beam irradiation of the same

EBARA CORP56 citations96
US6036783AMar 14, 2000

Liquid material vaporizer apparatus and gas ejection device

EBARA CORP63 citations96
US6005183ADec 21, 1999

Device containing solar cell panel and storage battery

EBARA CORP96 citations96
US5862605AJan 26, 1999

Vaporizer apparatus

EBARA CORP62 citations96
US5630881AMay 20, 1997

Thin-film forming apparatus with magnetic bearings and a non-contact seal and drive

EBARA CORP65 citations96
US6147408ANov 14, 2000

Method of forming embedded copper interconnections and embedded copper interconnection structure

EBARA CORP31 citations93
US6651871B2Nov 25, 2003

Substrate coated with a conductive layer and manufacturing method thereof

EBARA CORP31 citations92
US6486413B1Nov 26, 2002

Substrate coated with a conductive layer and manufacturing method thereof

EBARA CORP17 citations92
US6365017B1Apr 2, 2002

Substrate plating device

EBARA CORP31 citations92
US6558518B1May 6, 2003

Method and apparatus for plating substrate and plating facility

EBARA CORP36 citations91
US5829156ANov 3, 1998

Spin dryer apparatus

EBARA CORP40 citations91
US5705230AJan 6, 1998

Method for filling small holes or covering small recesses in the surface of substrates

EBARA CORP43 citations91
US5820649AOct 13, 1998

Method of and apparatus for continuously producing a solid material

EBARA CORP27 citations86
US6972256B2Dec 6, 2005

Method and apparatus for forming thin film of metal

EBARA CORP17 citations84
US6730596B1May 4, 2004

Method of and apparatus for forming interconnection

EBARA CORP19 citations84
US6054714AApr 25, 2000

Electron-beam irradiation apparatus

EBARA CORP16 citations84
US7799425B2Sep 21, 2010

Composite nanoparticles method for producing the same

EBARA CORP12 citations77
US6787467B2Sep 7, 2004

Method of forming embedded copper interconnections and embedded copper interconnection structure

EBARA CORP7 citations74
US6709555B1Mar 23, 2004

Plating method, interconnection forming method, and apparatus for carrying out those methods

EBARA CORP12 citations74
US6573201B1Jun 3, 2003

Method and apparatus for protection of substrate surface

EBARA CORP11 citations74
US6495004B1Dec 17, 2002

Substrate plating apparatus

EBARA CORP9 citations74
US6458694B2Oct 1, 2002

High energy sputtering method for forming interconnects

EBARA CORP7 citations74
US6455475B1Sep 24, 2002

Sliding member and process for producing the same

EBARA CORP8 citations74
US7033463B1Apr 25, 2006

Substrate plating method and apparatus

EBARA CORP10 citations73
US6793794B2Sep 21, 2004

Substrate plating apparatus and method

EBARA CORP7 citations73
US6929722B2Aug 16, 2005

Substrate plating apparatus

EBARA CORP2 citations63
US6432257B1Aug 13, 2002

Dresser for polishing cloth and method for manufacturing such dresser and polishing apparatus

EBARA CORP6 citations60
US4861395AAug 29, 1989

Method of using machine parts made of austenitic cast iron having resistance to stress corrosion cracking in contact with salt water

EBARA CORP5 citations56
US6391775B1May 21, 2002

Method of forming embedded copper interconnections and embedded copper interconnection structure

EBARA CORP0 citations52

TOSHIBA KK

2 patents

EBARA RES CO LTD

1 patent