Inventor
KURAISHI FUMIO
JP7 patents
Patents
7 patentsUS5859471AJan 12, 1999
Semiconductor device having tab tape lead frame with reinforced outer leads
SHINKO ELECTRIC IND CO323 citations97
US5365107ANov 15, 1994
Semiconductor device having tab tape
SHINKO ELECTRIC IND CO74 citations95
US6074567AJun 13, 2000
Method for producing a semiconductor package
SHINKO ELECTRIC IND CO41 citations91
US4809053AFeb 28, 1989
Semiconductor device and lead frame used therefor
SHINKO ELECTRIC IND CO50 citations91
US6081426AJun 27, 2000
Semiconductor package having a heat slug
SHINKO ELECTRIC IND CO25 citations90
US5905634AMay 18, 1999
Semiconductor package having a heat slug
SHINKO ELECTRIC IND CO24 citations90
US5384204AJan 24, 1995
Tape automated bonding in semiconductor technique
SHINKO ELECTRIC IND CO47 citations89