Inventor
SHIMIZU MITSUHARU
JP14 patents
Patents
14 patentsUS5410180AApr 25, 1995
Metal plane support for multi-layer lead frames and a process for manufacturing such frames
SHINKO ELECTRIC IND CO220 citations98
US5293301AMar 8, 1994
Semiconductor device and lead frame used therein
SHINKO ELECTRIC IND CO69 citations96
US5389816AFeb 14, 1995
Multi-layer lead frame using a metal-core substrate
SHINKO ELECTRIC IND CO29 citations92
US5291060AMar 1, 1994
Lead frame and semiconductor device using same
SHINKO ELECTRIC IND CO43 citations92
US5281556AJan 25, 1994
Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane
SHINKO ELECTRIC IND CO32 citations92
US5237202AAug 17, 1993
Lead frame and semiconductor device using same
SHINKO ELECTRIC IND CO52 citations92
US5235209AAug 10, 1993
Multi-layer lead frame for a semiconductor device with contact geometry
SHINKO ELECTRIC IND CO36 citations92
US6074567AJun 13, 2000
Method for producing a semiconductor package
SHINKO ELECTRIC IND CO41 citations91
US5804422ASep 8, 1998
Process for producing a semiconductor package
SHINKO ELECTRIC IND CO33 citations91
US5231756AAug 3, 1993
Process for manufacturing a multi-layer lead frame
SHINKO ELECTRIC IND CO27 citations91
US5576577ANov 19, 1996
Multi-layer lead-frame for a semiconductor device
SHINKO ELECTRIC IND CO26 citations89
US5070390ADec 3, 1991
Semiconductor device using a tape carrier
SHINKO ELECTRIC IND CO19 citations73
US5854094ADec 29, 1998
Process for manufacturing metal plane support for multi-layer lead frames
SHINKO ELECTRIC IND CO6 citations62
USRE35353EOct 22, 1996
Process for manufacturing a multi-layer lead frame
SHINKO ELECTRIC IND CO5 citations61