Inventor
LAI CHENG-YUAN
TW6 patents
⚠️ This page may combine multiple inventors who share the name “LAI CHENG-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
4 patentsUS6472741B1Oct 29, 2002
Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD230 citations96
US6716676B2Apr 6, 2004
Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD91 citations95
US6462405B1Oct 8, 2002
Semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD70 citations95
US6400014B1Jun 4, 2002
Semiconductor package with a heat sink
SILICONWARE PRECISION INDUSTRIES CO LTD76 citations95