Inventor
HAWKER CRAIG JON
US34 patents
Patents
34 patentsUS6423465B1Jul 23, 2002
Process for preparing a patterned continuous polymeric brush on a substrate surface
IBM161 citations99
US5895263AApr 20, 1999
Process for manufacture of integrated circuit device
IBM248 citations99
US6992115B2Jan 31, 2006
Preparation of crosslinked particles from polymers having activatible crosslinking groups
IBM66 citations98
US6890703B2May 10, 2005
Preparation of crosslinked particles from polymers having activatible crosslinking groups
IBM73 citations98
US6780492B2Aug 24, 2004
Substrates prepared by chemical amplification of self-assembled monolayers with spatially localized polymer brushes
IBM95 citations98
US6413587B1Jul 2, 2002
Method for forming polymer brush pattern on a substrate surface
IBM100 citations98
US6114458ASep 5, 2000
Highly branched radial block copolymers
IBM99 citations98
US6107357AAug 22, 2000
Dielectric compositions and method for their manufacture
IBM124 citations98
US6093636AJul 25, 2000
Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
IBM158 citations98
US6541865B2Apr 1, 2003
Porous dielectric material and electronic devices fabricated therewith
IBM42 citations96
US6342454B1Jan 29, 2002
Electronic devices with dielectric compositions and method for their manufacture
IBM67 citations96
US6111323AAug 29, 2000
Reworkable thermoplastic encapsulant
IBM76 citations96
US5883219AMar 16, 1999
Integrated circuit device and process for its manufacture
IBM69 citations96
US5767014AJun 16, 1998
Integrated circuit and process for its manufacture
IBM52 citations96
US6900126B2May 31, 2005
Method of forming metallized pattern
IBM24 citations92
US6685983B2Feb 3, 2004
Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens
IBM27 citations92
US6670285B2Dec 30, 2003
Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials
IBM41 citations92
US6355756B1Mar 12, 2002
Dual purpose electroactive copolymers, preparation thereof, and use in opto-electronic devices
IBM14 citations92
US6143643ANov 7, 2000
Process for manufacture of integrated circuit device using organosilicate insulative matrices
IBM21 citations92
US6177360B1Jan 23, 2001
Process for manufacture of integrated circuit device
IBM39 citations91
US6399666B1Jun 4, 2002
Insulative matrix material
IBM48 citations90
US5953627ASep 14, 1999
Process for manufacture of integrated circuit device
IBM40 citations90
US6333141B1Dec 25, 2001
Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture
IBM18 citations83
US6531343B1Mar 11, 2003
Method of encapsulating a circuit assembly
IBM5 citations74
US6512070B2Jan 28, 2003
Dual purpose electroactive copolymers
IBM9 citations74
US6433115B2Aug 13, 2002
Opto-electronic devices fabricated with dual purpose electroactive copolymers
IBM10 citations74
US6326237B1Dec 4, 2001
Reworkable thermoplastic hyper-branched encapsulant
IBM6 citations74
US5998876ADec 7, 1999
Reworkable thermoplastic hyper-branched encapsulant
IBM13 citations74
US6812551B2Nov 2, 2004
Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens
IBM5 citations73
US6110649AAug 29, 2000
Process for manufacture of integrated circuit device
IBM14 citations71
US7491425B2Feb 17, 2009
Scanning probe-based lithography method
IBM3 citations63
US8387160B2Feb 26, 2013
Scanning probe-based lithography method
IBM0 citations52
US7892635B2Feb 22, 2011
Precursors for porous low-dielectric constant materials for use in electronic devices
IBM0 citations52
US7862858B2Jan 4, 2011
Scanning probe-based lithography method
IBM0 citations52