Inventor
KUSANO HIDETOSHI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “KUSANO HIDETOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
18 patentsUS6051450AApr 18, 2000
Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus
SONY CORP72 citations96
US6940385B2Sep 6, 2005
High-frequency coil device and method of manufacturing the same
SONY CORP19 citations92
US6617236B2Sep 9, 2003
Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device
SONY CORP32 citations92
US6563202B1May 13, 2003
Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus
SONY CORP24 citations92
US6372620B1Apr 16, 2002
Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device
SONY CORP34 citations92
US6351025B1Feb 26, 2002
Semiconductor chip having an underplate metal layer
SONY CORP22 citations92
US7679184B2Mar 16, 2010
Semiconductor device having high cooling efficiency and method for manufacturing the same
SONY CORP9 citations84
US7216419B2May 15, 2007
Method of manufacturing a high-frequency coil device
SONY CORP10 citations84
US7880317B2Feb 1, 2011
Semiconductor device and method of manufacturing semiconductor device
SONY CORP10 citations80
US7421777B2Sep 9, 2008
Method of manufacturing multilayer wiring substrate using temporary metal support layer
SONY CORP12 citations79
US6403402B1Jun 11, 2002
Semiconductor chip having an underplate metal layer
SONY CORP5 citations74
US6340840B1Jan 22, 2002
Lead frame and production method thereof, and semiconductor device and fabrication method thereof
SONY CORP10 citations74
US6140153AOct 31, 2000
Lead frame, the manufacturing method, semiconductor device and the manufacturing method
SONY CORP7 citations74
US7420127B2Sep 2, 2008
Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
SONY CORP6 citations72
US6465279B2Oct 15, 2002
Lead frame and production method thereof, and semiconductor device and fabrication method thereof
SONY CORP4 citations63
US6369441B1Apr 9, 2002
Method of producing a semiconductor chip having an underplate metal layer
SONY CORP2 citations63
US6660941B2Dec 9, 2003
Electronic parts mounting board and production method thereof
SONY CORP4 citations61
US7288724B2Oct 30, 2007
Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
SONY CORP0 citations51