Inventor

LANDERS WILLIAM F

US18 patents

⚠️ This page may combine multiple inventors who share the name “LANDERS WILLIAM F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LANDERS WILLIAM F

IBM

Combined chemical mechanical polishing and reactive ion etching process

Structure and method for producing multiple size interconnections

Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor

Unique feature design enabling structural integrity for advanced low K semiconductor chips

Piezo-actuated CMP carrier

Structure and method for making crack stop for 3D integrated circuits

Method and structure for ultra narrow crack stop for multilevel semiconductor device

Method of fabricating a wire bond pad with Ni/Au metallization

Unique feature design enabling structural integrity for advanced low k semiconductor chips

Regeneration of chemical mechanical polishing pads in-situ

Apparatus and method for controlling polishing of integrated circuit substrates

Process of removing CMP scratches by BPSG reflow and integrated circuit chip formed thereby

Three dimensional organic or glass interposer

Method for fabricating last level copper-to-C4 connection with interfacial cap structure

Strengthening of a structure by infiltration

FAROOQ MUKTA G

Structure and method for making crack stop for 3D integrated circuits

TSV pillar as an interconnecting structure

Alignment marks to enable 3D integration