Inventor
ZHOU TIAO
US22 patents
⚠️ This page may combine multiple inventors who share the name “ZHOU TIAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS INC
12 patentsUS6900535B2May 31, 2005
BGA/LGA with built in heat slug/spreader
ST MICROELECTRONICS INC110 citations97
US7244967B2Jul 17, 2007
Apparatus and method for attaching an integrating circuit sensor to a substrate
ST MICROELECTRONICS INC52 citations96
US6998721B2Feb 14, 2006
Stacking and encapsulation of multiple interconnected integrated circuits
ST MICROELECTRONICS INC33 citations92
US6686227B2Feb 3, 2004
Method and system for exposed die molding for integrated circuit packaging
ST MICROELECTRONICS INC20 citations92
US7304362B2Dec 4, 2007
Molded integrated circuit package with exposed active area
ST MICROELECTRONICS INC15 citations84
US7315079B2Jan 1, 2008
Thermally-enhanced ball grid array package structure and method
ST MICROELECTRONICS INC7 citations74
US6817854B2Nov 16, 2004
Mold with compensating base
ST MICROELECTRONICS INC8 citations74
US6815262B2Nov 9, 2004
Apparatus and method for attaching an integrated circuit sensor to a substrate
ST MICROELECTRONICS INC9 citations74
US7294530B2Nov 13, 2007
Method for encapsulating multiple integrated circuits
ST MICROELECTRONICS INC6 citations73
US7402454B2Jul 22, 2008
Molded integrated circuit package with exposed active area
ST MICROELECTRONICS INC3 citations63
US7180175B2Feb 20, 2007
Thermally-enhanced ball grid array package structure and method
ST MICROELECTRONICS INC2 citations63
US6586821B1Jul 1, 2003
Lead-frame forming for improved thermal performance
ST MICROELECTRONICS INC3 citations63
MAXIM INTEGRATED PRODUCTS
7 patentsUS10608125B1Mar 31, 2020
Exposed die sensor package
MAXIM INTEGRATED PRODUCTS7 citations84
US9040408B1May 26, 2015
Techniques for wafer-level processing of QFN packages
MAXIM INTEGRATED PRODUCTS12 citations78
US9356003B1May 31, 2016
Highly integrated flex sensor package
MAXIM INTEGRATED PRODUCTS4 citations73
US9583425B2Feb 28, 2017
Solder fatigue arrest for wafer level package
MAXIM INTEGRATED PRODUCTS6 citations69
US9371982B2Jun 21, 2016
Glass based multichip package
MAXIM INTEGRATED PRODUCTS2 citations62
US9425064B2Aug 23, 2016
Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages
MAXIM INTEGRATED PRODUCTS0 citations41
US10204876B2Feb 12, 2019
Pad defined contact for wafer level package
MAXIM INTEGRATED PRODUCTS0 citations32