Inventor
YAO CHIN-TSAI
TW15 patents
⚠️ This page may combine multiple inventors who share the name “YAO CHIN-TSAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
12 patentsUS9190387B2Nov 17, 2015
Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function
SILICONWARE PRECISION INDUSTRIES CO LTD6 citations84
US10522453B2Dec 31, 2019
Substrate structure with filling material formed in concave portion
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations72
US10510720B2Dec 17, 2019
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD5 citations72
US9900996B2Feb 20, 2018
Package substrate and structure
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US9842771B2Dec 12, 2017
Semiconductor device and fabrication method thereof and semiconductor structure
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations71
US11973014B2Apr 30, 2024
Method of manufacturing substrate structure with filling material formed in concave portion
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US9013042B2Apr 21, 2015
Interconnection structure for semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations55
US10679932B2Jun 9, 2020
Semiconductor package and a substrate for packaging
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations52
US9425152B2Aug 23, 2016
Method for fabricating EMI shielding package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations52
US9368467B2Jun 14, 2016
Substrate structure and semiconductor package using the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations52
US9607963B2Mar 28, 2017
Semiconductor device and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50
US9520351B2Dec 13, 2016
Packaging substrate and package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50