Inventor

DANI ASHAY A

US17 patents

⚠️ This page may combine multiple inventors who share the name “DANI ASHAY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DANI ASHAY A

INTEL CORP

Heat dissipating device with preselected designed interface for thermal interface materials

Thermal interface material and electronic assembly having such a thermal interface material

Reworkable thermal interface material

Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same

Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials

Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Silicon wafer with soluble protective coating

Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application

Heat dissipating device with preselected designed interface for thermal interface materials

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Substrate integrated inductor with composite magnetic resin layer

Package structure to enhance yield of TMI interconnections

Reactive gettering in phase change solders to inhibit oxidation at contact surfaces

SIDHU RAJEN S

Substrate metallization and ball attach metallurgy with a novel dopant element

Functional material systems and processes for package-level interconnects

DE BONIS THOMAS J

Package structure to enhance yield of TMI interconnections