Inventor
PRAKASH ANNA M
US18 patents
⚠️ This page may combine multiple inventors who share the name “PRAKASH ANNA M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
16 patentsUS7332807B2Feb 19, 2008
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
INTEL CORP26 citations91
US9685413B1Jun 20, 2017
Semiconductor package having an EMI shielding layer
INTEL CORP12 citations78
US9953929B2Apr 24, 2018
Systems and methods for electromagnetic interference shielding
INTEL CORP2 citations72
US10168357B2Jan 1, 2019
Coated probe tips for plunger pins of an integrated circuit package test system
INTEL CORP2 citations67
US9991211B2Jun 5, 2018
Semiconductor package having an EMI shielding layer
INTEL CORP2 citations67
US11579426B2Feb 14, 2023
Dual collimating lens configuration for optical devices
INTEL CORP0 citations62
US7776657B2Aug 17, 2010
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
INTEL CORP3 citations61
US11156815B2Oct 26, 2021
Compound parabolic concentrator including protrusion
INTEL CORP0 citations59
US11022792B2Jun 1, 2021
Coupling a magnet with a MEMS device
INTEL CORP0 citations59
US10615128B2Apr 7, 2020
Systems and methods for electromagnetic interference shielding
INTEL CORP0 citations51
US9704811B1Jul 11, 2017
Perforated conductive material for EMI shielding of semiconductor device and components
INTEL CORP0 citations51
US7651020B2Jan 26, 2010
Amphiphilic block copolymers for improved flux application
INTEL CORP1 citations49
US10315200B2Jun 11, 2019
Apparatus and system for storing and transporting magnetic devices
INTEL CORP0 citations48
US10049971B2Aug 14, 2018
Package structure to enhance yield of TMI interconnections
INTEL CORP0 citations48
US9631065B2Apr 25, 2017
Methods of forming wafer level underfill materials and structures formed thereby
INTEL CORP1 citations48
US7843075B2Nov 30, 2010
Apparatus and methods of forming an interconnect between a workpiece and substrate
INTEL CORP0 citations45