P

Inventor

PRAKASH ANNA M

US18 patents
⚠️ This page may combine multiple inventors who share the name “PRAKASH ANNA M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

16 patents
US7332807B2Feb 19, 2008

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

INTEL CORP26 citations91
US9685413B1Jun 20, 2017

Semiconductor package having an EMI shielding layer

INTEL CORP12 citations78
US9953929B2Apr 24, 2018

Systems and methods for electromagnetic interference shielding

INTEL CORP2 citations72
US10168357B2Jan 1, 2019

Coated probe tips for plunger pins of an integrated circuit package test system

INTEL CORP2 citations67
US9991211B2Jun 5, 2018

Semiconductor package having an EMI shielding layer

INTEL CORP2 citations67
US11579426B2Feb 14, 2023

Dual collimating lens configuration for optical devices

INTEL CORP0 citations62
US7776657B2Aug 17, 2010

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

INTEL CORP3 citations61
US11156815B2Oct 26, 2021

Compound parabolic concentrator including protrusion

INTEL CORP0 citations59
US11022792B2Jun 1, 2021

Coupling a magnet with a MEMS device

INTEL CORP0 citations59
US10615128B2Apr 7, 2020

Systems and methods for electromagnetic interference shielding

INTEL CORP0 citations51
US9704811B1Jul 11, 2017

Perforated conductive material for EMI shielding of semiconductor device and components

INTEL CORP0 citations51
US7651020B2Jan 26, 2010

Amphiphilic block copolymers for improved flux application

INTEL CORP1 citations49
US10315200B2Jun 11, 2019

Apparatus and system for storing and transporting magnetic devices

INTEL CORP0 citations48
US10049971B2Aug 14, 2018

Package structure to enhance yield of TMI interconnections

INTEL CORP0 citations48
US9631065B2Apr 25, 2017

Methods of forming wafer level underfill materials and structures formed thereby

INTEL CORP1 citations48
US7843075B2Nov 30, 2010

Apparatus and methods of forming an interconnect between a workpiece and substrate

INTEL CORP0 citations45

DE BONIS THOMAS J

1 patent

SUPRIYA LAKSHMI

1 patent