Inventor
PATEL MITESH
US13 patents
⚠️ This page may combine multiple inventors who share the name “PATEL MITESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS7332807B2Feb 19, 2008
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
INTEL CORP26 citations91
US7291548B2Nov 6, 2007
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
INTEL CORP5 citations70
US7776657B2Aug 17, 2010
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
INTEL CORP3 citations61
US7253088B2Aug 7, 2007
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
INTEL CORP3 citations59