Inventor

TING CHIH-YUAN

TW81 patents

⚠️ This page may combine multiple inventors who share the name “TING CHIH-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TING CHIH-YUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Air gap structure and method

Patterning approach for improved via landing profile

Metal etching stop layer in magnetic tunnel junction memory cells

Interconnect structure and method of forming the same

Pattern fidelity enhancement with directional patterning technology

Memory device and fabrication method thereof

Contact plug without seam hole and methods of forming the same

Interconnect structure and method of forming the same

Contact plug without seam hole and methods of forming the same

Via corner engineering in trench-first dual damascene process

Interconnect structure and method of forming the same

Mitigating pattern collapse

Patterning approach for improved via landing profile

Interconnect structure and method of forming the same

Patterning approach for improved via landing profile

Systems and methods for in SITU maintenance of a thin hardmask during an etch process

Mitigating pattern collapse

Semiconductor device having air gap structures and method of fabricating thereof

Method and apparatus for back end of line semiconductor device processing

Interconnect structure and method of forming same

Via corner engineering in trench-first dual damascene process

Semiconductor device having air gap structures and method of fabricating thereof

Semiconductor device having air gap structures and method of fabricating thereof

Method of preventing pattern collapse

Interconnect line for semiconductor device

Patterning approach for improved via landing profile

Method and apparatus for back end of line semiconductor device processing

Contact plug without seam hole and methods of forming the same

Systems and methods for in SITU maintenance of a thin hardmask during an etch process

Interconnect structure for semiconductor devices

Air gap structure and method

Patterning approach for improved via landing profile

Integrated circuit with conductive line having line-ends

Interconnect structure and methods of forming the same

Integrated circuit

Interconnect structure and methods of forming the same

Integrated circuit

Interconnect structure and method of forming the same

Metal etching stop layer in magnetic tunnel junction memory cells

Method for manufacturing semiconductor structure

Integrated circuit

Pattern fidelity enhancement with directional patterning technology

Interconnect structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG

Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process

Patterning approach to reduce via to via minimum spacing

Method of preventing a pattern collapse

Systems and methods for in situ maintenance of a thin hardmask during an etch process

Method of forming interconnection structure having notches for semiconductor device

HSU JU-WANG

Fin field effect transistor and method of forming the same

LEE CHIA YING

Method of patterning for a semiconductor device