Inventor
ISE HIROSHI
JP10 patents
⚠️ This page may combine multiple inventors who share the name “ISE HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
3 patentsUS5356283AOct 18, 1994
Metal mold for sealing semiconductor devices with a resin
NEC CORP22 citations92
US6180435B1Jan 30, 2001
Semiconductor device with economical compact package and process for fabricating semiconductor device
NEC CORP19 citations81
US6491857B2Dec 10, 2002
Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein
NEC CORP1 citations50
UCHIDA SHINICHI
3 patentsUS8193038B2Jun 5, 2012
Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer
UCHIDA SHINICHI2 citations60
US8581368B2Nov 12, 2013
Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer
UCHIDA SHINICHI0 citations49
US8158505B2Apr 17, 2012
Method for manufacturing a semiconductor device, semiconductor chip and semiconductor wafer
UCHIDA SHINICHI0 citations49
JAPAN SYNTHETIC RUBBER CO LTD
2 patentsUS5093426AMar 3, 1992
Hydrogenated copolymer rubber, rubber composition comprising said rubber and rubber product obtained from the rubber
JAPAN SYNTHETIC RUBBER CO LTD35 citations91
US4912186AMar 27, 1990
Acrylic rubber, acrylic rubber composition and cured rubber article thereof
JAPAN SYNTHETIC RUBBER CO LTD14 citations71