Inventor
ZENZ CHRISTIAN
AT19 patents
⚠️ This page may combine multiple inventors who share the name “ZENZ CHRISTIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP BV
11 patentsUS9196537B2Nov 24, 2015
Protection of a wafer-level chip scale package (WLCSP)
NXP BV6 citations82
US8987057B2Mar 24, 2015
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging
NXP BV8 citations82
US9779349B2Oct 3, 2017
Method of producing a transponder and a transponder
NXP BV6 citations80
US9245804B2Jan 26, 2016
Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)
NXP BV4 citations71
US9536188B2Jan 3, 2017
Dual-interface IC card components and method for manufacturing the dual-interface IC card components
NXP BV3 citations68
US9424507B2Aug 23, 2016
Dual interface IC card components and method for manufacturing the dual-interface IC card components
NXP BV5 citations66
US11222861B2Jan 11, 2022
Dual-interface IC card module
NXP BV0 citations62
US10366320B2Jul 30, 2019
Dual-interface IC card
NXP BV1 citations62
US10896878B2Jan 19, 2021
Integrated circuit saw bow break point
NXP BV0 citations60
US8884415B2Nov 11, 2014
IC package with stainless steel leadframe
NXP BV3 citations56
US10461057B2Oct 29, 2019
Dual-interface IC card module
NXP BV0 citations51
ZENZ CHRISTIAN
4 patentsUS8628018B2Jan 14, 2014
RFID circuit and method
ZENZ CHRISTIAN10 citations82
US8695207B2Apr 15, 2014
Method for manufacturing an electronic device
ZENZ CHRISTIAN2 citations60
US9425500B2Aug 23, 2016
Antenna or a strap for accommodating an integrated circuit, an antenna on a substrate, a strap for an integrated circuit and a transponder
ZENZ CHRISTIAN0 citations40
US8669123B2Mar 11, 2014
Method of and device for determining and controlling the distance between an integrated circuit and a substrate
ZENZ CHRISTIAN0 citations39