Inventor

KAMPHUIS TONNY

NL17 patents

⚠️ This page may combine multiple inventors who share the name “KAMPHUIS TONNY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KAMPHUIS TONNY

NXP BV

Reducing defects in wafer level chip scale package (WLCSP) devices

Protection of a wafer-level chip scale package (WLCSP)

Encapsulated wafer-level chip scale (WLSCP) pedestal packaging

Reduction of defects in wafer level chip scale package (WLCSP) devices

Reduction of defects in wafer level chip scale package (WLCSP) devices

Single inline no-lead semiconductor package

Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)

Wafer level chip scale semiconductor package

Integrated circuits and molding approaches therefor

Dual interface IC card components and method for manufacturing the dual-interface IC card components

Maximizing potential good die per wafer, PGDW

Integrated circuit and method of manufacturing the same

Fan-out chip scale package

Integrated circuits on a wafer and methods for manufacturing integrated circuits

Heatsink very-thin quad flat no-leads (HVQFN) package

Nexperia BV

Semiconductor device and method of making a semiconductor device

GULPEN JAN

Fan-out chip scale package