Inventor
KASEMSET BODIN
TH4 patents
Patents
4 patentsUS9424507B2Aug 23, 2016
Dual interface IC card components and method for manufacturing the dual-interface IC card components
NXP BV5 citations66
US9595455B1Mar 14, 2017
Integrated circuit module with filled contact gaps
NXP BV2 citations61
US8884415B2Nov 11, 2014
IC package with stainless steel leadframe
NXP BV3 citations56
US10727168B2Jul 28, 2020
Inter-connection of a lead frame with a passive component intermediate structure
NXP BV0 citations28