Inventor

KOIDE MASATERU

JP22 patents

⚠️ This page may combine multiple inventors who share the name “KOIDE MASATERU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOIDE MASATERU

FUJITSU LTD

Apparatus for laser cutting wiring in accordance with a measured size of the wiring

Process of wirebond pad repair and reuse

Semiconductor device having reformed pad

Circuit board and electronic device

Multilayer interconnection substrate and manufacturing method therefor

Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same

Power supply connection structure to a semiconductor device

Packaging method, packaging structure and package substrate for electronic parts

Packaging method, packaging structure and package substrate for electronic parts

Circuit board, method of manufacturing circuit board, and electronic device

Method of manufacturing semiconductor device mounting structure

Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus

Package substrate and method of manufacturing package substrate

Electronic part and method of manufacturing the same

Circuit board with a thin-film layer configured to accommodate a passive element

Package mounting structure

Method of manufacturing board

KOIDE MASATERU

Multi-chip module

Interconnect board, printed circuit board unit, and method

Multichip module and method for manufacturing the same

Electronic part and method of manufacturing the same

SAKUYAMA SEIKI

Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same