Inventor

BRUN JEAN

FR33 patents

⚠️ This page may combine multiple inventors who share the name “BRUN JEAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRUN JEAN

COMMISSARIAT ENERGIE ATOMIQUE

Method for making an anisotropic conductive polymer film on a semiconductor wafer

Microelectronic interconnect device comprising localised conductive pins

Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed

Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof

Sensor, in particular accelerometer, and actuator with electric insulation localised in a substrate plate

Miniaturized accelerometer of the type using spring compensation of the effect of gravity and its production process

Micro-battery fabrication process including formation of an electrode on a metal strip, cold compression and removal of the metal strip

Gravity-compensation type accelerometer and process for producing such an accelerometer

Method and device for fabricating an assembly of at least two microelectronic chips

Sealing cell and method for encapsulating a microelectronic component with such a sealing cell

Assembly for housing wire elements

Method for producing an anisotropic conductive film on a substrate

Incorporation of chip elements in a core yarn

Process for manufacturing an electrically conductive member for an electronic component comprising an end equipped with a cavity

BRUN JEAN

Method for producing a set of chips mechanically interconnected by means of a flexible connection

Method for fabricating chip elements provided with wire insertion grooves

Inclusion of chip elements in a sheathed wire

Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element

Method for assembling a chip in a flexible substrate

Method for producing chip elements equipped with wire insertion grooves

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly

Use of a fabric comprising a specific material for detecting the presence of a chemical substance

Stacked electronic device and method of making such an electronic device

Method for assembling a microelectronic chip device in a fabric, chip device, and fabric incorporating a crimped chip device

VICARD DOMINIQUE

Method for assembling at least one chip using a fabric, and fabric including a chip device

Apparatus for assembling chip devices on wires

Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure

Assembly of radiofrequency chips

Photovoltaic cell, method for assembling plurality of cells and assembly of a plurality of photovoltaic cells

THOMSON CSF

System for the display of luminous data with improved readability

BAILLIN XAVIER

Method for producing a structure

(unassigned)

Structure comprising an insulated part in a solid substrate and method for producing same